Photonics Integration and Packaging

Swiss PIC, the Swiss Photonics Integration Center organizes a workshop on Photonics Integration and Packaging supported by Swissphotonics and CSEM.

With the ever-increasing demand of photonic systems in existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification. The workshop addresses these challenges and is a unique opportunity to discuss with colleagues and develop new solutions.
  Labtour

• Micro-optics / micro-optical interconnects cleanroom tour
  • Starting at 11:30, max number of participants: 6.
• PIC testing and characterization
  • Starting at 11:15, max number of participants: 8

In case of interest please send an E-Mail to andreas.voelker@csem.ch !
Cost
This workshop is free of charge

Registration compulsory
This Workshop is free of charge, but registration is required. The link is on top of the page. If you would like to register more than one participant, please fill for each an individual form.
The workshop is full and the registration is closed!
Program

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11:00	Registration and coffee
11:00-13:00	Labtour
12:00-13:00	Lunch
13:15	Welcome
13:30	Industrial packaging (requirements)
14:30	Networking break
15:00	Components and processes
16:00	Networking Break
16:30	Packaging services
17:30	Apéro
19:00	End

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Detailed Program

Date
Thursday, 21 March 2024

Venue


CSEM SA
Rue Jaquet-Droz 1
2002 Neuchâtel
Switzerland





Contact Swiss PIC
Dr. Peter Moselund
CEO Swiss PIC
+41 76 765 5519

Contact CSEM
Dr. Andreas Völker
Head Business Development Photonics CSEM
+41 76 442 2429

Contact Swissphotonics
Dr. Christian Bosshard
Managing Director Swissphotonics
+41 79 405 1826



29 January 2024, Christian Bosshard

Technologies and Markets - III